This position is dedicated to a project that aims on maximize synergies within the BI group, and potentially at a sector level, the digital electronics at the surface buildings for those systems will be based on the future Beam Instrumentation (BI) platform for modular electronics.

In this position, you will have a key role in the development of the digital electronics for the LHC BPM consolidation and the future BI platform for modular electronics. In particular, you will:

• Participate in the definition of strategy for the LHC BPM consolidation and the future BI platform for modular electronics;
• Collaborate with the BE-CEM group in the definition, selection and evaluation of standards and technologies for the future BI platform for modular electronics;
• Select and evaluate different options for the development of system on module (SoM) (e.g. custom design, component of the shelf (COTS));
• Select and evaluate field-programmable gate array (FPGA) and system on chip (SoC) from different vendors (e.g. Intel FPGA, AMD Xilinx);
• Develop hardware (HW), FPGA gateware and SoC firmware for SOM, to be used for test and qualification purposes, as well as for the standard framework provided with the future BI platform for modular electronics;
• Collaborate with BE-CEM and SY-BI-SW in the interface between the future BI platform for modular electronics and the software (SW) infrastructure at CERN.

Skills and/or knowledge

• Knowledge of digital electronics;
• Experience in Printed Circuit Board (PCB) design;
• Experience with FPGA and SoC;
• Experience in SW programming (e.g. Python scripts)
• Experience with high-speed interfaces is a plus (e.g. Ethernet, multi-gigabit transceivers);

You have a professional background in Electronics Engineering (or a related field) and have either:

• a Master's degree with 2 to 6 years of post-graduation professional experience;
• or a PhD with no more than 3 years of post-graduation professional experience.